Oregon Wafer Level Assembly Process Engineer
You will be a member of the Oregon Wafer Level Assembly (OWLA) organization at Intel's Ronler Acres campus. This new Wafer Level Assembly process is an integral part of Intel's Foveros technology.
As a Wafer Level Assembly engineer, you will be responsible for all aspects of your assigned module including safety, quality, output, cost of operation, and labor productivity. The scope of work and responsibilities of an Oregon WLA engineer are very similar to those of a fab module engineer. You will be expected to:
- Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.
- Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.
- Coordinate these efforts with our development partners in Oregon.
This is an entry level position and will be compensated accordingly.Qualifications
Minimum qualifications are required to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences, and or schoolwork/classes/research.
- Candidate must possess a Bachelors's or Master's degree in an Engineering and/or Science discipline such as Physics, Applied Physics, Chemistry, Materials Science, Chemical Engineering, Mechanical Engineering, or Electrical Engineering.
- 0-1+ years in semiconductor industry experience via graduate research, internship, or prior employment.
- 0-1+ years in statistical process control techniques, data analysis, and model-based problem solving.