Oregon Wafer Assembly Process Engineer
You will be a member of the growing Oregon Wafer Level Assembly (OWLA) organization at RA4 on the Ronler Acres campus. Oregon Wafer Level Assembly is an integral part of Intel's new FOVEROS technology.
As a Process Engineer, you will be responsible for all aspects of your assigned module including safety, quality, output, cost of operation, and labor productivity. Responsibilities include, but are not limited to:
- Collaborating with OWLA and Technology Development engineering teams to develop a first of a kind toolset and deliver process transfer to High Volume Manufacturing (HVM).
- Defining roadmaps to meet requirements, goals and milestones for a new technology process.
- Defining and establishing flow, procedures, and equipment configuration for the module.
- Designing, executing and analyzing experiments necessary to meet engineering specifications.
- Working effectively with the equipment supplier to identify shortcomings, propose and evaluate hardware modification to mitigate issues.
- Establishing process control systems for the module.
- Sustain the day-to-day operations of your area by responding to, containing, and dispositioning safety and quality concerns, addressing down tools, and implementing solutions to prevent repeat incidents.
- Continuously improve your area by proactively identifying and implementing safety and ergonomic improvements, excursion prevention measures, methods to increase tool utilization, and reduce cost.
The ideal candidate should exhibit the following behavioral traits:
- Written and verbal communication skills.
- Influence others and build consensus and trust within a team.
- Making technical decisions and providing technical direction.
- Learning new processes and tools.
- Analytical and problem-solving skills
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
- Candidates must possess a Master's degree in Physics, Chemistry, Electrical, Chemical or Mechanical Engineering, Material Science, or equivalent STEM field and 3+ years in a semiconductor environment or assembly experience.
- PhD degree in Physics, Chemistry, Electrical, Chemical or Mechanical Engineering, Material Science, or equivalent STEM field and 1+ years in a semiconductor environment or assembly experience.