Sr. Failure Analysis Engineer (SK)
This is an exciting time to be at Intel. Come join Intel's NAND Design Technology and Manufacturing (NAND-DTM) Group and work on one of the most advanced 3DNAND and SSD technology portfolios in the world. As a global leader in the semiconductor industry, Intel possesses many industry leading SSD technologies including the most capable Quadruple Level Cell QLC NAND Flash products.
Job responsibilities include, but are not limited to:
- Conduct electrical and physical fault isolation of 3D NAND devices with tester, parametric analyzer, mechanical probing, and various fault isolation tools for design debug, low yield analysis, reliability test failure, and customer returns.
- Work with lab technicians to prepare devices to meet desired fault isolation requirements and assist failure analysis processes to locate the physical defect.
- Validate the link between the identified physical defect and the original failure mode.
- Communicate with stakeholders on the progress and publish analysis reports promptly.
- Evaluate existing fault isolation and failure analysis (FIFA) capabilities to identify gaps for future product support.
- Lead and drive new FIFA capability development to minimize the risk.
The ideal candidate will demonstrate the following:
- Leading small teams.
- Great communication with written and verbal.
- Stellar team player.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynixQualifications
Bachelors in Electrical Engineering with 4+ years of related experience.
- Failure analysis of semiconductor devices.
- Experience with semiconductor physics, photon/thermal emission-based analysis techniques, oscilloscope, parametric analyzer, and material analysis tools (Scanning Electron Microscopy, Focused Ion Beam, Transmission Electron Microscopy, etc) is desired.
Masters in Electrical Engineering with 3+ years of prior experience in the minimum qualifications.
- Led tool/capability development.
No jobs have been viewed recently.View All Jobs
No jobs have been saved.View All Jobs