NAND Product Quality and Reliability Engineer (SK)
In this position, you will be working as a member of the NAND Design, Technology and Manufacturing Group's (NDTM) Quality and Reliability team, helping to develop Intel's new 3D NAND technologies and system-level storage products, focusing on Non-Volatile Memory (NVM) reliability.
The 3D NAND Product QRE will be responsible for but not limited to:
- Designing and executing experiments to identify, segment, characterize and model NVM reliability mechanisms.
- Developing empirical and physics-based predictive reliability modeling methods and tools for reliability risk assessments.
- Developing new acceleration techniques, test methods, and analytical tools to provide fast and effective feedback for reliability process optimization.
- Determining reliability requirements and technology targets of components and systems to achieve company, customer, and other reliability objectives.
- Developing the appropriate process- and product-qualification stress methods and criteria.
- Influencing design, process, product, test, and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies and exploration of novel memory cells.
- You may be expected to lead small cross-functional and cross-company groups of engineers on multi-disciplinary technical projects to solve complex reliability issues- such as, during technology development and ramp to high-volume manufacturing.
- Understand the high-level picture and apply systems thinking to generate solutions.
The ideal candidate should exhibit the following behavioral traits:
- Demonstrated attention to detail and quality of the work.
- Demonstrated persistence and commitment to the task.
- Clearly communicate achieved results and influence a wide range of audiences.
- Work well in a team setting with people from a wide range of backgrounds.
- Systematic analytical problem-solving.
- Demonstrated creativity and innovation in solving technical problems.
- Affinity for cross-disciplinary work.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynixQualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
The candidate must have a Bachelor's degree in Electrical, Engineering, Computer Engineering, Materials Science, Physics, or a related field.
4+ years of experience in the following areas:
- Semiconductor device physics and materials science.
- Probability and statistics, VLSI circuit design, semiconductor processing, and quantum physics.
- Experimental design, execution, and data analysis, interpretation, and synthesis.
- Programming (C or C++, PERL, or Python).
Master's degree in Electrical, Engineering, Computer Engineering, Materials Science, Physics, or related field with 3+ years of experience in the minimum qualifications.
Ph.D. with 1+ years of experience in minimum qualifications.
- CMOS transistor level circuit design, semiconductor device physics/engineering, memory reliability, interconnect reliability, computer or digital systems, or board level design.
- Non-volatile memories, especially product or reliability.
- Analytical lab test equipment such as Logic analyzer/oscilloscopes, semiconductor parametric analyzer (CV-IV), memory testers, SEM/TEM/IREM.
- Reliability failure statistics, physics, or failure mechanisms.
- Statistical analysis packages (e.g., R, JMP).
- Computer programming for testing, preferably of memories, and data acquisition, reduction, analysis, and visualization.
- Semiconductor fabrication.