NAND Product Quality and Reliability Engineer (SK)
In this position, you will be working as a member of the NAND Design, Technology and Manufacturing Group's (NDTM) Quality and Reliability team, helping to develop Intel's new 3D NAND technologies and system-level storage products, focusing on NVM (non-volatile memory) reliability.
The 3D NAND Product QRE will be responsible for, but not limited to:
- Designing and executing experiments to identify, segment, characterize and model NVM reliability mechanisms.
- Developing empirical and physics-based predictive reliability modeling methods and tools for reliability risk assessments.
- Developing new acceleration techniques, test methods, and analytical tools to provide fast and effective feedback for reliability process optimization.
- Determining reliability requirements and technology targets of components and systems to achieve company, customer, and other reliability objectives.
- Developing the appropriate process- and product-qualification stress methods and criteria.
- Influencing design, process, product, test and/or system solutions in order to enable aggressive scaling of Intel's NVM technologies and exploration of novel memory cells.
- You may be expected to lead small cross-functional and cross-company groups of engineers on multidisciplinary technical projects to solve complex reliability issues - such as, during technology development and ramp to high-volume manufacturing.
- Understand the high-level picture and apply systems thinking to generate solutions.
The ideal candidate should exhibit the following behavioral traits:
- Demonstrated attention to detail and quality of the work.
- Demonstrated persistence and commitment to the task.
- Clearly communicate achieved results and influence a wide range of audiences.
- Work well in a team setting with people from a wide range of backgrounds.
- Systematic analytical problem-solving.
- Demonstrated creativity and innovation in solving technical problems.
- Affinity for cross-disciplinary work.
This position is in the NAND-DTM Group which is aligned to phase 2 of the sale of the NAND business to Solidigm, a wholly owned subsidiary of SK hynix. Employees in this business group will work on developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm. Solidigm, a leading global supplier of NAND flash memory solutions, is headquartered in San Jose, California with offices worldwide.Qualifications
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. The experience listed below would be obtained through a combination of your schoolwork/classes/research and/or relevant previous job and/or internship experiences. This is an entry-level position and will be compensated accordingly.
The candidate must have a Bachelor's degree in Electrical, Engineering, Computer Engineering, Materials Science, Physics, or a related field.
9+ months of experience in the following areas:
- Semiconductor device physics and materials science.
- Probability and statistics, VLSI circuit design, semiconductor processing, and/or quantum physics.
- Experimental design, execution, and data analysis, interpretation, and synthesis.
- Programming (C or C++, PERL, or Python).
Master's degree in Electrical, Engineering, Computer Engineering, Materials Science, Physics, or a related field.
6+ months of experience in the following areas:
- CMOS transistor-level circuit design, semiconductor device physics/engineering, memory reliability, interconnect reliability, computer or digital systems, or board-level design.
- Non-volatile memories, especially product or reliability.
- Analytical lab test equipment such as Logic analyzer/oscilloscopes, semiconductor parametric analyzer (CV-IV), memory testers, SEM/TEM/IREM.
- Reliability failure statistics, physics, or failure mechanisms.
- Statistical analysis packages (e.g., R, JMP).
- Computer programming for testing, preferably of memories, and data acquisition, reduction, analysis, and visualization.
- Semiconductor fabrication.