Nand Product Engineer
Responsible for ensuring the testability and manufacturability of integrated circuits from the component feasibility stage through production ramp. Make significant contributions to design, development and validation of testability circuits. Evaluation, development and debug of complex test methods. Develops and debugs complex software programs to convert design validation vectors and drive complex test equipment. Creates and tests validation and production test hardware solutions. Tests, validates, modifies and redesigns circuits to guarantee component margin to specification. Analyzes and evaluates component specification versus performance to ensure optimal match of component requirements with production equipment capability with specific emphasis on yield analysis and bin split capability. Analyzes early customer returns with emphasis on driving test hole closure activities. Creates and applies concepts for optimizing component production relative to both quality and cost constraints. Autonomously plans and schedules own daily tasks, develops solutions to problems utilizing formal education and judgment. Also, you will have oversea USA on job training opportunities, transfer the new product technology node.Qualifications
Must Have a BS or MS degree or PHD in Electrical or semiconductor or similar degree.
Past Nand/DRAM Product Engineer experienced, with excellent problem-solving and analytical skills.
Know JMP software, layout/circuit tracing, using magnum II/V to debug Nand failure or test development issues.
Fluent in English communication in both writing and presentation.
Self-motivation and enthusiasm to growth and learning new knowledge
Nice to Have-Prior experience and familiarity with JMP scripting, Python and PERL.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix
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