DTD Thin Films Deposition Area Manager
INTEL NAND TD at Intel Dalian is technology development organization to develop future generations of 3D NAND process technologies through innovation, product enhancement, as well as developing and enabling equipment and process capabilities. This job requisition is to seek experienced candidate for Intel Dalian TD Thin Films Deposition Area Manager. In this role, the selected candidate will manage a team of world-class process engineers and CVD/PVD tools, and report to the DTD Thin Films Director. The job responsibilities include leading state-of-art 3D NAND film deposition process and equipment development (such as patterning hardmask, structural film, gap fill, metallization), co-owning the technology transfer and synergy with high volume production team, and collaborating with US Pathfinding team for equipment and process enablement.Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization. Direct people management experience is required.Qualifications
MS or PhD in a science or engineering field and minimum 10 years of experience in semiconductor process research and development environment are required;
Broad and deep knowledge of CVD and PVD equipment and processes is required;
Hands-on experiences in technology development and technology transfer are highly desired;
Motivated self-starter, with strong ability to work independently as well as in a team environment;
Strong verbal and written communication skills in English.
a. Think and operate independently, while simultaneously focusing on many diverse priorities.
b. Flexibility and maturity in facing uncertainties and changing priorities/responsibilities
c. Commit to aggressive goals and win with a can-do attitude
d. Act with velocity and a strong sense of urgency
e. Respect cultural diversity and sensitivity
f. Agility in learning, improving, and innovating
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel's Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynix
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