DMTM ME1 Director
Intel Dalian (DMTM) has been rapidly expanding for last few years, and grew to an advanced 3D NAND facility with over 3500 talents organization. The facility includes both high volume manufacturing(HVM) and technology development(TD), which is currently developing multiple generations of cutting edge 3D NAND technology, and producing over 1 million revenue wafers with the world class safety, technology, quality, yield, output and cost.
This job requisition is to seek strong candidates for HVM ME Director positions based in Dalian, China, reporting to the Sr. HVM Director of Dalian Memory Technology and Manufacturing (DMTM). The selected candidates will primarily focus on 3D NAND high volume manufacturing Fab operations and partner with TD Directors to execute TD Si to meet the development milestones. The selected candidates must have demonstrated a track record of excellence in leading a large engineering or manufacturing organization to meet/exceed expectations around safety, quality, yield, technology transfer/start-up, output, and cost. The candidate must have demonstrated the ability to build a compelling vision and mission for the org. with excellent communication skills and the ability to motivate the organization. The candidate must have demonstrated a role model for Intel culture values, also have demonstrated strong ethical standards and be able to set the tone from the top. The candidate must be able to lead in a highly ambiguous and dynamic business environment. The candidate must have a minimum of 3+ years directly managing manufacturing or engineering area. The direct working experiences and technical knowledge in non-volatile memory technology as a plus.
The position is associated with the sale of the NAND business to SK Hynix aligning to Phase 2 of the transaction. Employees aligned to Phase 2 will continue to be employed by Intel developing NAND technology and components. Phase 2 of the transaction is expected to close in March 2025 at which time employees aligned to this phase of the transaction will transition employment to Solidigm, a stand-alone US subsidiary of SK Hynix headquartered in San Jose, California with offices world-wide. Solidigm is a leading global supplier of NAND flash memory solutions, led by Robert (Rob) B. Crooke as CEO, previously senior vice president and general manager of Intel’s Non-Volatile Memory Solutions Group. To read more, see: https://www.intc.com/news-events/press-releases/detail/1513/intel-sells-ssd-business-and-dalian-facility-to-sk-hynixQualifications
You should possess a BS, Master's degree or a Doctorate in Engineering fields
Experience in transfer, start up, and ramp of a high volume manufacturing facility, running 300mm wafer fab processes.
Hands-on experience in Engineering and Manufacturing areas.
Ability to direct and make technical decisions is a requirement.
More than 2+ years AM or DM experience in Engineering or Manufacturing Dept is required.
Leadership and management skills to lead highly technical org
Good understanding of factory and/or fabrication operations.
A strong understanding of semiconductor process flow technology issues, manufacturing science and systems, and engineering applications.
Working knowledge of technical development, as well as demonstrated experience establishing and maintaining successful relationships with partner organizations, internal and external, to drive aggressive roadmaps.
Demonstrated passion towards innovation and risk-taking in order to achieve excellence.
Fluency in English, good command of Mandarin is a plus