Semiconductor Packaging Engineer

Job Description

We are driven by our purpose: To create world-changing technology that improves the life of every person on the planet. We develop technologies that bring down barriers and enable tomorrow’s greatest scientific breakthroughs and cultural achievements.

When you join Intel, you become part of a global organization with big ambitions. Our people have had a profound influence on the world by creating radical innovations that revolutionize the way we live.

Sales and Marketing Group (SMG) creates world – changing outcomes with our customers and the ecosystem by leading with our technology solutions and go-to-market innovation.

Intel's IDM 2.0 strategy includes a plan to significantly expand the manufacturing network, establishing new capacity and capability to meet the accelerating global demand for semiconductors. The external Packaging and Assembly Engineering team (EPAE) will play a critical role in this strategy, leveraging external assembly technologies to deliver leadership products. This position is a Deputy Platform Manager for Flip Chip technologySeeking a Flip Chip assembly expert to strengthen the external assembly platform management team through deep understanding of Flip Chip assembly technology. With the key objectives to help setting up competitive and easy to use assembly platforms you will be expected to support the operative part, structuring, and execution platform goals; Build a strong and intimate relationship with the team across multiple levels and organizations, timely execute/drive established tasks in close collaboration with the platform manager and partner teams. Lead progress of generation of technical spec and assessments and design rules for product sourcing to NPI. Direct influence and enablement of platform programs through broad technical experience and expertise.The ideal candidate should exhibit the following behavioral traits:

• Motivated self-starter / self-driven with strong ability to work independently as well as influence the team.

• Excellent communication, tolerance of ambiguity, and commitment to tasks.

• Skills to address complex problems and find solutions.

• Highly collaborative that can effectively drive stakeholders to win results for Intel.

• Excel in leading in a highly matrixed development environment.

• Executes toward results with focus and a sense of urgency.

• Motivated individual with a can-do attitude.

• Is willing to take informed risks to achieve desired team goals.

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Master's Degree in an Engineering field relevant to Research and Development activities in VLSI design, materials or semiconductor manufacturing or a related field of study.

• 4+ years of relevant experience in the assembly and packaging area.

• 4+ years of hands-on experience leading developments in flip chip packaging.

Preferred Qualifications:

• A Ph.D. degree in an Engineering field.

• 4+ years of experience:

  • With design and design rules.

  • In advanced packaging technologies development or pathfinding

  • In virtual basic programming and CAD drawing.

Inside this Business Group

Intel's Sales and Marketing (SMG) organization works with global customers and partners to solve critical business problems with Intel based technology solutions. SMG works across business units to amplify the customer voice and deliver solutions that accelerate their business. We work across numerous industries, including retail, enterprise and government, cloud services and healthcare as examples. The operations team focuses on forecasting, driving alignment with factory production and delivering efficiency tools and our marketing capability drives demand and localized marketing in locations around the globe. Our sales force navigates a complex partner and customer ecosystem while shaping product roadmaps, driving value for our customers, and collaborating to harness emerging technology trends to deliver comprehensive solutions.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.Annual Salary Range for jobs which could be performed in the US $161,230.00-$227,620.00*Salary range dependent on a number of factors including location and experience

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.