Vice-President MSO, General Manager of Disaggregation Manufacturing Operation
Hillsboro, Oregon, United States| Albuquerque, New Mexico, United States| Phoenix, Arizona, United States Job ID JR0257860 Job Category Manufacturing and Process Development Work Mode Hybrid Experience Level Experienced
The DMO General Manager is responsible for the safety, quality, output and cost of the Disaggregation Manufacturing Operation (DMO). Disaggregation is a critical emerging manufacturing capability enabling Intel’s leadership products. The DMO GM leads Intel’s worldwide advanced packaging foundry, Silicon Photonics development/manufacturing and certain CMOS foundry operations. In addition the group is responsible for the development of new interposer and bridge technologies. The DMO GM is an executive leadership role overseeing a staff of senior leaders and Vice Presidents and a large global organization.
• Enabling InteI’s IDM 2.0 strategy by leading a World-Class Advanced Packaging Foundry.
• Leading DMO to deliver new technologies, implement new business models, and support manufacturable & cost competitive foundry and systems.
• Active collaboration with technology development organizations to start-up and ramp new technologies to high volume and develop game-changing methodologies to enable significant operational improvements
• All operational aspects of DMO which operates advanced and high-volume facilities globally:
o Safety: DMO has a complex manufacturing environment with safety as the top priority
o People: Global org health, engagement, and development across multiple locations
o Quality: Delivering products that meet/exceed quality commitments to customers
o Cost: Manage a large operational budget with a goal to achieve world-class costs. Responsible for driving to and exceeding Product Margin goals.
o Output: Deliver consistent output on technologies and new product introductions to meet/exceed customer demand.
This role requires experiences in:
• Leading a global semiconductor manufacturing network and third-party suppliers, including experience in fab process, supply chain and materials management, and quality assurance
• Operational Excellence to identify and manage opportunities to improve safety, costs, output, quality/yields and other KPIs as well as expanding and optimizing the manufacturing network.
• Technical leadership in semiconductor manufacturing processes; breadth of experience across wafer fab and back-end processes (assembly and test), and tooling.
• Developing future innovation and/or emerging capabilities
• Collaborating, influencing and working across a highly matrixed organization with process development, supply chain, product/business and other engineering teams on joint roadmap development and other co-dependencies.
• Recognizing material, process-oriented and/or delivery issues which have a substantive impact on profitability.
• Articulating the implications of issues in financial terms and impact on P&L.
• Building relationships with key ecosystem partners and leveraging internal and external relationships– and working with Technology Development/R&D and Engineering, Finance, IT, HR and partner-suppliers to drive innovation and operational efficiency, as well as working with and understanding the operations of suppliers and construction.
Key leadership capabilities include:
• Leading large diverse global organizations
• Strong manufacturing and operational experience and leadership
• Strong execution and results focus
• Superior networking and influencing skills and the ability to build followership
• A combination of business acumen, organizational savvy, and technical expertise
• Ability to work cross-organizationally through matrix reporting structures to accomplish strategic objectives as well as organizational development goals
• Excellent business judgment & acumen, strategic vision, and negotiation skills
• Solid financial analysis skills, including creating and understanding different industry and Intel business unit models to optimize financial results for Intel
• Semiconductor foundry experience preferred
Bachelor's degree in engineering, science, or a related field. MSc or PhD is considered a plus
15 years of direct semiconductor factory experience with a strong technical background
10 years of management experience in semiconductor fab, advanced packaging, or assembly test
Experience managing managers, 2nd level managers and senior technical contributors
Strong working knowledge of device physics, process technology and assembly-test
Detailed understanding of model-based problem solving as well as Fab process control systems and methodologies
Experience leading large fab operations including engineering and manufacturing factory functions
Experience managing external manufacturing partnerships and suppliers.
Experience working for a world-class semiconductor foundry
Advanced packaging experience
Technology development experience