DTD technology development process integration/yield engineer
Intel Dalian is rapidly expanding its 3D NAND high volume manufacturing facility, while starting-up a new Dalian Technology Development (TD) organization to develop future generations of 3D NAND process technologies. And now we are seeking for many strong candidates to work on ramping up 3D NAND TD business in coming year.
This job requisition is look for multiple candidates for the positions of Yield Engineer, FA Engineer, Defect Reduction Engineer, Integration Engineer, Device Engineer, Quality and Reliability Engineer, and Test Engineer, reporting to Integration or Device Engineering Managers.
Examples of scope of work include silicon process improvement and product enhancement, device capability evaluation and expansion, and wafer cost reduction.
Candidates must have demonstrated a track record of excellence in creative problem solving, device or test capability enabling, or manufacturing process optimization in a relevant engineering organization.
• Perform feasibility study and provide integrated process solutions to meet desired device specification and process improvement requirements
• Lead new device experimentation, implementation and high volume manufacturing readiness in the area of expertise
• Define, explore and qualify new integrated process solutions to meet quality and output needs of new processes for high volume manufacturing ramp.
This position is associated with the sale of Intel’s NAND memory and storagebusiness to SK Hynix (You can read more about the transaction in the press release - https://newsroom.intel.com/wp-content/uploads/sites/11/2020/10/nand-memory-news-q-a.pdf). The transaction will enhance the resources and potential of the business’ storage solutions, including client and enterprise SSDs, in the rapidly growing NAND Flash space amid the era of big data.
This is an exciting time to be at Intel – come join our NAND-DTM and work on the most advanced 3DNAND and SSD technology in the world. As the global leader in the semiconductor industry, Intel possesses industry-leading SSD technology and the most capable Quadruple Level Cell (QLC) NAND Flash products, and you will be part of a world-class team that will transition to lead the SSD business at SK Hynix.
This position aligns to Phase 2 of the transaction, which includes NAND technology and component development along with fab operations. Employees aligned to Phase 2 will continue to be employed by Intel and will continue to develop NAND technology and components and manufacture NAND wafers at the fab. Phase 2 of the transaction is expected to close in March 2025, at which time employees aligned to this phase of the transaction will transition employment to SK Hynix.
--BS, MS, or PhD in a science or engineering field and minimum 3 years of experience in semiconductor research, development or manufacturing environment are required;
--Demonstrated technical leadership and a track record of problem solving with creativity and out-of-box thinking
--Hands-on experiences in technology development, technology transfer or startup are required
--Strong expertise of process characterization, qualification and troubleshooting is required;
--Direct experience in Silicon Process Technology Development is highly desired.
--Motivated self-starter, with strong ability to work independently as well as in a team environment;
--Strong verbal and written communication skills in English;
--Think and operate independently, while simultaneously focusing on many diverse priorities.
--Flexibility and maturity in facing uncertainties and changing priorities/responsibilities
--Commit to aggressive goals and win with a can-do attitude
--Act with velocity and a strong sense of urgency
--Respect cultural diversity and sensitivity
--Agility in learning, improving, and innovating