Develops the logic design, register transfer level (RTL) coding, and simulation for mixed signal and/or highspeed IPs required to generate cell libraries, functional units, IP blocks, and subsystems for integration in full chip designs. Participates in the definition of architecture and microarchitecture features of the block being designed. Applies various strategies, tools, and methods for mixed signal designs including analog behavior modeling and circuit simulation to write RTL and optimize mixed signal logic to qualify the design to meet power, performance, area, and timing goals as well as design integrity for physical implementation. Reviews the verification plan and implementation to ensure design features are verified correctly and resolves and implements corrective measures for failing RTL tests to ensure correctness of features. Supports SoC customers to ensure highquality integration of the IP block.
Responsibilities will include but not limited to
-Understanding reliability mechanisms that limit performance of Intel products.
-Defining creative solutions to characterize these mechanisms through circuit design on test chips, architect the test chips, and develop design definitions. Work with Quality and Reliability test chip design team for solution implementations and Quality and Reliability labs for Si characterizations of reliability mechanisms.
-Collaborating with product design/architecture and Quality and Reliability teams to develop architectural solutions for reliability optimization of Intel products.
-Requiring expansive knowledge and practical application of circuit and product reliability methodologies at Intel.
-Candidate must possess a PhD/M.Tech in Electrical Engineering, Computer Engineering, Applied Physics, Physics, or related field.
� Minimum of 5+ years with Ph.D or 8+ years M.Tech of experience with digital and analog circuit design.
� Technical expertise on lab test program development, design of experiment development, data collection, analysis.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
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This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.