Responsible for full-chip floorplanning and design planning for SoC or subsystem/subFC under a technical/integration lead. Defines the physical dimensions of the IP or SoC with consideration for overall product costs such as die size optimization, die per reticle/good die per wafer maximization, and right technology selection as it pertains to metal layers and reuse strategy across different SKUs in a product family. Establishes the integration plans for disaggregated die with optimization for package and board constraints. Performs under supervision, the integration of all dies in a package and completes the relevant checks before tapeout. Creates and physical database for the IP or SoC. Helps creates specifications and collaterals for the IP blocks to execute the floorplan and automatic place and route (APR) at subsequent hierarchies. Collaborates with the clock design and logic design teams to deliver the physical block level floorplans for APR. Collaborates with the power delivery team on tradeoffs for metal allocation for signal and power.
Bachelor or Masters degree in Electrical/Electronics/Computer Engineering with around 2 years of relevant experience
Exposure to full-chip floorplanning, design planning for multiple style of floorplans including partitioning and pin-cutting for large SoCs and basic idea of related areas like bump-planning, rdl routing, analog, full chip-integration activity
Exposure to LV cleanup, power-planning, ESD, PG grid generation
Proficiency in using multi vendor EDA tools including ICC2, FC, or other SNPS/CDNS tools etc
PKG and platform knowhow/exposure, SORT/CLASS test awareness is a definite plus
PnR flow experience/Timing analysis knowhow, physical aware synthesis awareness
Proficiency in programming language /scripting(Perl, tcl, Python) is a plus
Inside this Business Group
The Network & Edge Group brings together our network connectivity and edge into a business unit chartered to drive technology end to end product leadership. It's leadership Ethernet, Switch, IPU, Photonics, Network and Edge portfolio is comprised of leadership products critically important to our customers.
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.
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This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.