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Job ID: JR0041409
Job Category: Engineering
Primary Location: Chengdu, Shanghai CN
Other Locations:
Job Type: College Grad

Die Prep Engineer

Job Description
Improve equipment stability and reduce downtime to deliver consistent output for high volume manufacturing.Improve quality and yield performance through PCS, failure data analysis and commonality study.Optimize the equipment, process and material consumption to improve production efficiency and reduce cost.Transfer new products from development site and ramp it after qualification.Investigate process excursion, define root cause, containment and preventive actions.Collaborate with other stakeholders in local and virtual factory to speed up problem solving and maximize learning across different platforms.


Master degree in engineering background: mechanics/electrics/material/automation....English communication capability in reading/writing/speaking.Knowledge in database, SQL and coding experience is preferred.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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