NM Advanced Packaging TD Integrator Engineer

Job Description

NM Program and Technology Office is seeking an Advanced Packaging TD Integrator which will be responsible for developing new advanced package offerings that require direct start-up in DMO factories. These are Foundry and Internal Intel based technologies. This individual will partner with other TD partners and the NM/DMO factory sites to enable the development/transfer of new technologies to the site. These will include 1st of a kind processes to Intel as related to the Advanced Package and Bumping segments of the process flow. The individual will work with Assembly Design teams, Module TD engineers, Materials/Media Engineering, ATTD Integration, Intel Foundry and Site/Factory management.

As Advanced Packaging TD Integrator you will be responsible for but not limited to:

• Advanced packaging process integration and understanding of upstream and downstream process steps and impacts.
• Manage silicon during development and start-ups. This includes tracking critical lots through the factory line, dispositioning and validating material health during early stages of development and characterization.
• Strong ability to complete and comprehend in-line data and failure analysis.
• Ability to build and validate models.
• Expert understanding of process tools and materials.
• Initiates and drives task forces where needed to ensure critical deliverables are met on schedule.
• Collaboration with cross-site/functional teams and Intel partners to deliver process requirements on schedule, quality and cost targets.

The ideal candidate should exhibit the following behavioral traits:

• Willingness to close deliverables in a timely manner and do so in an independent manner.
• Willingness to extend trust to technical experts and leverage their skills.
• Organizational influence - able to get things done through their network of connections.
• High tolerance of ambiguity and demonstrated flexibility and adaptability in fast changing environment.
• Demonstrated track record of problem solving with creativity and out-of-box thinking as well as future, strategic, possibility thinking.
• Demonstration of strong partnership skills with various stakeholders.

Full time onsite required during training, estimated 6 months. After training: hybrid "work from home" to be defined by manager and employee but continued onsite will be required.

Relocation assistance will provided

Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Minimum Qualifications:

• Must hold a Master's degree in engineering and have demonstrated increasing levels of technical leadership responsibilities as well as a minimum of 5 years of semiconductor manufacturing experience, or 2+ Years of advanced packaging experience.
• Demonstrated engineering/integration experience within the last year.
• 1+ years leading collaborative efforts between Virtual factory sites and Development organizations, lead and drive activities to successful completion, and mentor others on resolving technical issues.
• Must have experience with lot shipment process, understanding of ULT data structure and ship point management.
• Experienced in creating lot structures on the fly and address issues related during critical silicon periods, or otherwise.

Preferred Qualifications:

• Strong understanding of process flows, understanding of key/control parameter importance and determination of minimum technology requirements for tool sharing/back qualification opportunities.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support.  Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.