3DIC Flow Designer

Penang, Malaysia Job ID JR0259296 Job Category Silicon Hardware Engineering Work Mode Hybrid Experience Level Experienced Full/Part Time Full Time

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Job Description

As an integral part of Intel's new IDM2.0 strategy, we are establishing Intel Foundry Services (IFS), a fully vertical, standalone foundry business, reporting directly to the CEO. IFS will be a world-class foundry business and major provider of US and European-based capacity to serve customers globally. Intel Foundry Services will be differentiated from other Foundry offerings with a combination of leading-edge packaging and process technology, committed capacity in the US and Europe - available for customers globally - and a world-class IP portfolio that customers can choose from including x86 cores, graphics, media, display, AI, interconnect, fabric and other critical foundational IP, along with Arm and RISC-V ecosystem IPs. IFS will also provide access to silicon design services to help our customers seamlessly turn silicon into solutions, using industry-standard design packages.

This business unit is completely dedicated to the success of its customers with full P and L responsibilities. This model will ensure that our foundry customers' products will receive our utmost focus in terms of service, technology enablement and capacity commitments. IFS is already engaged with customers today starting with our existing foundry offerings and we are expanding imminently to include our most advanced technologies, which are optimized for cutting-edge performance, making them ideal for high-performance applications.

About the Role:
We are looking for a highly motivated and proactive semiconductor 3D IC flow and design engineer with strong PDN, SI/PI and EMIR design experiences.

Responsibilities may include, but are not limited to:

Participate in 3D IC reference design flow development using Intel advanced 3D IC packaging processes to strategically promote Intel technologies to customers.
Participate in development of 3DIC PDN architecture and validation flows using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.
Focus on SI/PI signoff flow using commercial tools from vendors such as Synopsys, Cadence, Siemens, Ansys, etc.
Participate in lab evaluation for prototype 3D IC reference design.
Cross-functional interface with IC design, CAD/DAE, thermal and system/product teams.
Evaluate Intel foundry packaging technologies and propose areas of improvement to ensure Intel competitive edge; support internal and external customers to facilitate Intel technology enablement and customer solution development.

Qualifications

Minimum Requirements:

Bachelor of Science in Electrical Engineering or related fields.
Knowledge in advanced package and design.
Experience on 2DIC and 3DIC PDN Design and Architecture.
Experiences in 2D simulation tools for extracting package layout models for power integrity and signal integrity (PI and SI) analysis.
Experiences with PI and SI simulation flow and methodology.
Excellent interpersonal, analytical, written, and verbal communication skills; strong team player.

Preferred Experiences in one or more items below:

Experiences in high-speed package or board design and layout.
Experiences with Intel Foveros and EMIB technologies.
Experiences in 3D simulation tools for extracting package layout models for power integrity and signal integrity (PI and SI) analysis.
Experiences with advanced chiplet design with multiple dies such as HBM's, GPU's and CPU's.
Experiences with 2D, 2.5D and/or 3D packaging integration design.
Familiar with various packaging technologies such as BGA, fcCSP, WLCSP, system-in-package SiP, multi-chip modules MCM, wire-bond, heterogenous integration, AiP, AoP, SoC Solder ball, Cu pillar, hybrid, thermocompression, and bonding techniques.
Familiar with packaging knowledge that includes SMT, flip chip, bonding, molding, underfill, dispense, EMI shielding, lid, and solder ball attach.
OSAT or foundry 2.5D or 3D packaging design experience.
Experiences with thermal analysis and thermal measurement at die and package levels.

Inside this Business Group

Intel Foundry is dedicated to transforming the global semiconductor industry by delivering cutting-edge silicon process and packaging technology leadership for the AI era. As stewards of Moore's Law, we innovate and foster collaboration within an extensive partner ecosystem to advance technologies and enable our customers to design leadership products. Our strategic investments in geographically diverse manufacturing capacities bolster the resilience of the semiconductor supply chain. Leveraging our technological prowess, expansive manufacturing scale, and a more sustainable supply chain, Intel Foundry empowers the world to deliver essential computing, server, mobile, networking, and automotive systems for the AI era. This position is part of the Foundry Services business unit within Intel Foundry, a customer-oriented service organization that is dedicated to the success of its customers with full P&L responsibilities. We ensure our foundry customers' products receive our utmost focus in terms of service, technology enablement and capacity commitments.

Posting Statement

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation. Find more information about all of our Amazing Benefits here.

Working Model

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. In certain circumstances the work model may change to accommodate business needs.

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