Job Description We are looking for technical leaders who can help develop and drive 400G product development so that we grow our market share and contribute to Silicon Photonics Solution Group's mission to transform and lead datacenter connectivity and enable Intel's differentiation in the networking space. In this role, the individual will be involved in developing key high speed mixed signal designs from architecture to product. Responsibilities will include driving system High speed, electrical & optical specifications, defining circuit architectures and enabling designs meeting power, performance and cost for next generation optical interconnects. Essential Responsibilities: Designs/develops product/system architectures, defines key capabilities and performance requirements Defines total systems design and technology maturity constraints that meet mission requirements Develops systems and system element architecture and design and interface definitions Defines system implementation approach and operational concept Develops models and architectural guidelines for future system development Ensures requirements are met and evaluates performance with customer Satisfies customer's needs throughout a system's life cycle Performs analyses at all phases of product development life cycle to include: concept, design, fabrication, test, installation, operation, maintenance and disposal Performs system and subsystem integration, technical risk assessments, technical planning, verification and validation, and supportability and effectiveness analyses of total systems throughout the system lifecycleProvides proposal strategy development and review as required
Masters of Science, Ph.D. or equivalent experience in Electrical Engineering or closely related field, plus 10-15 years of experience in fiber optics, optical networking, optical and RF modulation, and data networking architectures.Experience in high speed signal circuit design, simulation and implementation.Expert in end to end signal Integrity and Channel modeling, power plane integrity of complex system-on-chip systemExperience in high speed semiconductor packaging design, simulation and implementation.Experience with physical layer optical transmission systems, ROSA/TOSA/BOSA, modulators, receivers, optical polarization, link impairments and link budget.Experience with different modulation PAM4/NRZ formats, optical direct detection, coherent detection, and the fundamental digital signal processing DSP algorithms such as polarization de-multiplexing and clock/carrier recovery, is required.Deep understanding of RF IC Transceiver architectures, design & tradeoffsExperience with design of high speed mixed signal circuits e.g., SerDes - analog/DSP based architectures, RX/TX equalizationExperience with design of Analog RF front end circuits such as Drivers, Trans-Impedance Amplifiers TIA, limiting amplifiers, etc. Good understanding of low noise PLL, Clocking and data recovery architectures. System knowledge of current generation and next generation optical transceiver architectures and standards.Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.Excellent time and task management, and inter-personal skills.Willingness to travel when required
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.