Drives high speed IO signal integrity and power delivery related technology development and design of packages and interconnects for future products on Intel's roadmap. The main responsibility is to develop necessary methodology and metrology core competencies in modeling and lab work to support the aforementioned efforts. Defines overall electrical performance specification and realizes technology certification through extensive design, analysis and validation activities. Conducts and supports research through internal and external programs on fundamental areas pertinent to circuits, packages, and interconnects. Collaborates with other engineers in the team and helps establish a team atmosphere promoting growth of core competency areas.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth