Join the development of 3G/4G/CDMA modem software as part of the CDMA Products and Development (CPD) group in ICDG. We are looking for a Firmware Engineer to join in the design, development and integration of Layer 1 modem baseband software in several of Intel’s 3G/4G wireless modem chipsets. The candidate should be a self-motivated problem solver experienced in embedded controller/DSP firmware development and modem technology. You will work with geographically dispersed cross functional teams.
Responsibilities will include but are not limited to:
Develop real-time embedded software/firmware for advanced microcontroller and DSP based wireless products with a focus on modem baseband physical layer. Baseband subsystems consist of a mix of modem processing functions, RF control, low level protocols, HW engine/accelerator control.
Write and review software design documents which describe the software architecture, implementation and interactions within the various subsystems.
Define and perform complex baseband and RF measurements and tests, analyze logs and data with focus on performance, test coverage and power consumption.
Evaluate and optimize design, timing and state sensitive flows and parameters for achieving optimal software and overall performance.
Engage with other cross-functional teams for collaborative working, design reviews, brainstorming and troubleshooting.
Behavioral traits for this position include the following:
Good verbal and written communication/presentation skills for expressing technical ideas and initiatives.
Self-motivated and good teamwork skills.
Strong ability to work with ambiguity, flexible in approach, creative in problem solving.
Proven ability to work across organizational, functional and cultural boundaries.
Risk taking to explore new possibilities for improvement and innovation.
Successful candidates must possess the below minimum qualifications to be initially considered for this position. Experience would be obtained through your work in previous companies, educational level research and/or relevant job experiences. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.
Master’s degree in Computer Science, Computer Engineering or Electrical Engineering.
Minimum 5 years of experience in PHY and MAC layer software design, implementation, integration and testing.
Hands-on experience in embedded software/firmware design and development with excellent C/C++ and assembly programming skills, scripting and other high level languages.
Experience in working with ARM and other microcontrollers and DSPs, real-time debugging tools, ICE, lab instrumentation.
Experience with modem baseband MAC and PHY Layer, baseband front-end AGC, AFC, DLL loops, RF Transceiver configuration, control and calibration.
Ability to understand complex designs and concepts and then implement well-structured and efficient embedded software/firmware to realize, integrate and verify these designs.
Solid theoretical and practical knowledge acquired through a combination of experience and education. Good foundation in wireless communications systems and signal processing concepts. Understanding of CDMA, OFDM and 4G and 5G wireless technologies and familiarity with protocol stack and standards.
Inside this Business Group
Communication & Devices Group: The wireless revolution at Intel! We are one team - passionate engineers and technologists from diverse industry backgrounds working together to realize a world of connected computing. We are bringing the best ideas from the brightest minds to deliver future mobile experiences into the market. We are on the journey towards making Intel a wireless leader with exciting products for the Internet of Things, 5G and an opportunity to change the world with your work.