The Intel NVM Non Volatile Memory Process Technology Development group is responsible for developing state of the art NVM memory technologies like 3D-NAND & 3D-Xpoint. As a Scribe Design / Parametric e-test Engineer/ Lead, you will be responsible for initial design/ tape-out and test of a scribe parametric E- test structures. Responsibilities include, but are not limited to: Develop and maintain scribe parametric e-test structures, test chip layouts by interacting with deice, test, modeling and process integration engineers. Design innovative structures to help with yield issues and process debugUse DF2, Cadence, K2View, PCELLS to develop and layout of the parametric structures. Develop and maintain parametric structure documentation and help in developing the parametric workbook. Set up and test the parametric structures on industry standard testers,Perform DRC checks, layout vs. schematic and netlist extraction tools to ensure correctness in layout of scribe test structures. Drive diagnostic projects across multi-disciplinary teams to understand product and test structure failures and their interaction with layout and mask synthesized data.
BS or MS, with at least 10+ year relevant industry experience in Scribe Design and Parametric E-test testing of semiconductor devices and interconnect
In-depth knowledge of scribe architecture including test structures,
In-depth knowledge of DRC/LVS, can fix most DRC/LVS issues that come up
Work with the LVS/DRC maintenance group to build new models as needed.
In-depth knowledge of CAD tools and software, in particular DF2, K2view and Hercules.
Basic knowledge of device physics and parametric analysis of data.
Good understanding of parametric testers/ bench measurement tools.
Good verbal & written communication skills with Excel, Visio & Power Point proficiency.Inside this Business Group
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.