As a member of the System and Components Division, the candidate will join an experience team of engineers and mentors and will be in a position to make important contributions to the development of silicon reference platforms and overall system architecture in support of server platform designs. In this position you will learn and apply both practical and hands on skills with proactive mentoring from a team of experienced Thermal and Mechanical Engineers.
Job responsibilities will include:
Candidate should show interest in electronics cooling related topics and have a desire to learn and perform hands on instrumentation and testing. Depending on experience and projects, candidate may also participate in some mechanical design and thermal modeling activities.
Candidate should have following behavior skills:
Candidate should be able to support an internship for at least 3 months and preferably up to 6 months.
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Must be pursuing a BS degree in Mechanical Engineering.
Preferred Requirements / Skills:
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.