As a Packaging Process Development Leader, you'll be part of Intel's Silicon Photonics team that is leading the 400G-market transition and driving innovation for next generation of optical interconnect products.
You will play a critical role in the next generation silicon photonics wafer and chip level packaging and assembly designs.
Specific job responsibilities include:
Provide semi-conductor packaging process development leadership to the team.
Take Silicon Photonics wafer & chip level packaging and assembly product from concept to HVM release through an OSAT partner.
Leveraging expertise in development of advanced packaging technology and processes and expertise in substrate materials and molding compound materials, work with cross-functional teams to select the optimized package solution, e.g., FCBGA, FCMCM, WLCSP fan-in, wafer/panel-level fan-out, chip-on-chip, package-on-package, stacked-die, TSV Si-interposer, etc.
Perform Failure/Root cause analysis and feedback to OSAT assembly process, SPC metrics to achieve high end-to-end assembly yield
Drive DFx for IC packaging design and assembly, Process FMEA, characterization and monitoring
Review substrate/IC design files, Provide assembly process related constraint file to aid package designs.
Provide DFM based DRCs and BKM design methods for IC pad/bump design and substrate/package/PCB designs e.g., Cadence Allegro Package DesignerDrive stress and temperature modeling to validate packaging and process architecture
Lead collaborative reviews with key stakeholders and executive sponsors
Oversee and lead the OSAT packaging process development effort from concept through initial production rampPartner with Module HW, Mechanical, Photonics, IC, SW/FWTest, Operations and Reliability teams
PhD w/ 3+ years or MS w/ 6+ years of industry experience in IC packaging and assembly experience with 25Gbps serial I/O interconnects strongly preferred
Have track record of successful HVM semi-conductor package assembly process development
Proven success with building strong relationships with OSAT partners, experience working with Asia-based manufacturers
Expertise in mass reflow and TC bonding for flip chip assembly process - chip on chip, chip on substrate and PCB SMT, Ball attach, Under-fill processes Hands-on experience on package assembly tools a plus
Knowledge of substrate manufacturing
Knowledge of failure analysis and assembly metrology techniques
Clear verbal and written communication skills
Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.