This is an Intel contract employee ICE position with a contract employment period of 11 months with no relocation package or permanent visa sponsorship available.
As a Radio Frequency (RF) IC Physical Design Engineer, you would be responsible for creating bottoms-up elements of chip design including but not limited to FET, cell, and block-level custom layouts, FUB-level floor plans, abstract view generation, RC extraction and schematic-to-layout verification and debug using phases of physical design development including parasitic extraction, static timing, wire load models, clock generation, customer polygon editing, auto-place and route algorithms, floor planning, full-chip assembly, packaging, and verification.
In addition, you would be responsible for:
- Troubleshooting a wide variety up to and including difficult design issues and applied proactive intervention
- Scheduling, staffing, executing and verifying complex chips development and execution of project methodologies and/or flow developments
- Requires expansive knowledge and practical application of methodologies and physical/layout design.
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through relevant previous jobs and/or research experiences.
Intel Labs, the New Business Initiatives group (NBI), the Perceptual Computing Group and the New Devices Group (NDG). Additionally, New Devices Group and the New Business Initiatives group were combined into the New Business Group (NBG) which nests into NTG.