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Job ID: JR0052689
Job Category: Engineering
Primary Location: Santa Clara, CA US
Other Locations: US, New Mexico, Albuquerque
Job Type: Experienced Hire

RSD- Silicon Photonics Process Development and Integration

Job Description

Intel's Silicon Photonics Product Division SPPD is seeking a R&D Process Development and Integration Engineer to work as the interface between the Si photonics components design team and the fabrication team. You will be part of the SPPD Process development and Integration Team responsible for building and maintaining a strong partnership between the design and fabrication entities. You will work in a fast-paced, dynamic organization developing building blocks for the next generation intel Si photonics products.Key responsibilities: Define, discover, develop, and deploy new process and integration solutions to enable Intel photonics process roadmap and product portfolio.Responsible for effective collaboration with Fabrication team for the assigned scope To understand process flow details, integration challenges, opportunities and limitations Chair technical meetings between the two entities and own the communication between them. Process & integration expert within the component design organization and provide technical input to the designers for the fabrication of their components. Responsible for delivering robust, repeatable and manufacturable fab processes in collaboration with the fab. Collaborate with fab for delivering desired process capability Cpk Responsible for new process development and pathfinding. Collaborate with Fab and QRC to deliver certified dot processes. Division POC for fab program planning, interfacing, objective setting, measurement/metrics, and issue resolution Manage yield and cost roadmaps with the fab. Responsible for change control through CCB Responsible for understanding design/process interaction, and exploiting or mitigating same. Responsible for leveraging layout and DA owners in providing efficient, mistake free, mask design support to design engineers Responsible for enabling design automation and design rule checking tools and PDK development for SiP Own the fabrication execution of the component R&D roadmap, responsible for fabrication process and integration technology gap closure plans, creating process flows, capability development process and equipment, NPI throughput, problem solving, quality and schedule. Define and drive process improvement and technology roadmap to deliver capable/reliable processes to enable and even accelerate the component roadmap. Work with Pathfinding process development and Integration owner to ensure all technical gaps/needs for the process roadmap are closed effectively. Identify opportunities for IP generation and protection. Serve as the primary decision maker accountable for NPI device development/integration/Fab/Layout and DA team. Own overall test chip execution and coordination including chip design, layout and tape-out, test and validation, performance debug, reliability qualification, and known-good-die delivery. Job responsibilities may also extend to include Drive and sustain systemic improvements. Own collaboration projects to meet and exceed intel and industry benchmarks for cost, throughput and yield targets. Emphasis on taking a strategic approach to influence pricing, productivity, process performance, and advancements in technology. Refurbish program management to systematically improve ROI and reduce risk Drive vendor projects spanning multiple areas to meet Intel targets- tool, process, software, and equipment control. Set up and optimize milestones and work models, procure resources needed for project success. Drive vendor roadmaps for technology and capital intensity to align with Intel targets. Develop business processes/change management around vendor engagement. Coordinate with multiple internal customers to act as single person driving all strategic CIP with vendors. Leverage suppliers as resources for operations. Engage externally with suppliers and/or industry consultants to collect benchmarking data/knowledge and ensure this information feeds into strategies leverage this knowledge/data to drive priorities and close gaps in performance and feed into equipment roadmaps. Interface with procurement global supplier account managers to ensure technical requirements feed into procurement strategies for suppliers. Quality/Spares/supply chain roadmap management Prioritize and manage multiple projects based objectives. Move projects effectively through project lifecycle - definition, planning, implementation, acceptance and review. Proactively manage changes in project scope, identify potential crises and devise contingency plans.


Minimum Qualifications

MS or PhD in physics, chemistry, chemical engineering, materials science & engineering, Mechanical eng, electrical engineering, Photonics/Opto-electronics or related field and 6+ years of hands-on working experience in state-of-the-art CMOS and/or photonics fab with first-hand experience in developing, integrating and maturing fab processes.

Direct experience in process development and process integration in several of the following process areas: Photolithography, Dry Etch, Thin FilmsPVD/CVD/ALD, Evap, Epitaxy, Wet Cleans, Yield & Metrology / Defect Inspection

Diffusion to help develop, select and deploy world class semiconductor manufacturing equipment

Additional qualifications preferred

A decent understanding of optical communications, photonic component design, process simulation and CMOS or photonics device physics and experience in photonic device development will be beneficial in a successful candidate.

Good knowledge of standard materials analysis techniques, data acquisition and analysis, DOE statistical methods is a plus.

Experience in managing and delivering leading edge equipment and process capability, yield, cost and manufacturability.

Experience in working in a matrixed organization in collaboration with cross-functional/cross-company teams and tool vendors to meet challenging program goals.

The successful candidate is expected to exhibit the following traits:

Passionate about advanced technology development. Have a growth mindset and eager to continuously learn and improve. Can thrive in a in a multi-disciplinary environment. Can effectively practice informed risk taking. Have strong communication, influencing and problem solving skills. Assumes ownership and make and meet commitments.

Experience in leading cross-functional engineering teams in development of innovative optoelectronic components.

Ability to plan and drive complex, multi-disciplinary projects to success. Relentless focus on quality as well as on-schedule execution.

Experience in optical communication, fiber optics, and optical transceiver technologies for datacenter applications.

Excellent written and oral communication skills

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Other Locations

US, New Mexico, Albuquerque

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.

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