F68 Technology and Strategy Office TSO at Intel Dalian is forming a new engineering team with focus on manufacturing cost reduction through innovation, product enhancement, as well as developing and enabling equipment and process capabilities for future generations of 3D NAND technologies.
This job requisition is to seek for strong candidates for the positions of Module Engineering Manager, reporting to Process Solutions Area Manager in TSO.
The selected candidates will build and manage several strong teams of process and equipment engineers, and direct all process, hardware, materials, and operational activities within their areas, manage and coach engineers, and guide employee development, performance, and productivity issues.
This requisition has two openings.
Thin Film Module Engineering Manager will manage CVD/PVD/CMP/Diffusion/Implant/Metro areas, and Patterning Module Engineering Manager will manage Lithography/Wet Etch/Dry Etch areas.
*The position requires up to 2 years of expatriate assignment in Dalian, China.
Candidate must have demonstrated a track record of excellence in creative problem solving, equipment capability enabling, or manufacturing process optimization in a relevant engineering organization, and must have direct people management experiences.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.
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