ATTD is looking for a Defect Characterization LYA Engineering Intern to join a team tasked with developing substrate, assembly and test technology development. Successful Intern will be a member of the ATTD Yield team responsible for defect characterization and identification in package. Intern must be able to use and interpret data from various analytical and microscopy techniques. Successful Intern will independently drive recommendations for defect characterization toward root cause identification, develop best known methods for defect characterization and report-out findings.
The ideal candidate should exhibit the following behavioral traits: As ATTD is a startup environment, the Intern should have:
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth