Packaging R&D Intern join Assembly Test Technology Development's module engineering team as a technical driver in the discovery, development, and deployment of Intel's advanced flip-chip packaging technology. Responsibilities will include, but not be limited to, assembly processes and/or equipment development, and applying novel concepts to technology solutions for next-generation CPUs and devices. You will also be helping develop innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Other Job Description: In this position, you will be developing process and equipment to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Your responsibilities will include, but not be limited to:
The ideal candidate should exhibit the following behavioral traits:
Inside this Business Group
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences Minimum Qualifications: Be currently being a pursuing an MS or PhD degree in Chemistry, Physics, Materials Science, Chemical Engineering, Mechanical Engineering or a related field of study.- Ability to apply fundamental science and engineering concepts to novel manufacturing processes. Strong knowledge of Statistical Process Control SPC and/or Design of Experiments DOE principles. Preferred Qualifications: Experience and knowledge in semiconductor packaging process would be an added advantage.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth