Packaging R&D Intern join Assembly Test Technology Development's module engineering team as a technical driver in the discovery, development, and deployment of Intel's advanced flip-chip packaging technology. Responsibilities will include, but not be limited to, assembly processes and/or equipment development, and applying novel concepts to technology solutions for next-generation CPUs and devices. You will also be helping develop innovative solutions to enable Intel's roadmap of future assembly packaging platform technologies. Other Job Description: In this position, you will be developing process and equipment to meet quality, reliability, cost, yield, productivity and manufacturability requirements.
Your responsibilities will include, but not be limited to:
Innovating, problem solving, developing, and continuously improving equipment and processes using experimental design and statistical methods.
Process and equipment specification development, applying principles for design of experiments and data analysis, and planning and documentation of improvements through the white paper process.
Developing solutions to problems utilizing formal education, statistical knowledge, and problem-solving tools.
The ideal candidate should exhibit the following behavioral traits:
Strong technical and analytical skills, including a fundamental understanding of semiconductor devices and fabrication processes and technology.
Self-initiated with the ability to work independently to influence organizational decisions.
Demonstrate strong written and verbal communication skills.
Ability to lead and influence both external and internal teams, and to work effectively in a team environment.
Flexibility in changing priorities and responsibilities to support business needs.
Tolerance for ambiguity in a fast paced, constantly changing product roadmap environment.
Hands-on participation and a strong sense of ownership.
Aptitude for delivering results for complex, time critical technical projects in a demanding team environment.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth