Intern will be a member of the Thermal & Fluids Lab within ATTD Core Competency. For this internship position, candidates will be working on the thermal characterization of innovative thermal solutions and novel thermal interface materials. The work includes multiple aspects in the definition and development of customized metrologies for the study of design, materials and process interactions within Intel's packages. The intern is expected to develop solutions to problems using formal education and judgement. As part of the job function, intern will be expected to work in a team environment and interact with fellow engineers to define and implement lab experiments for the validation of concepts to support new package technology development.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth