The Experimental Mechanics Lab identifies and solves thermo-mechanical issues in the field of electronic packaging. The lab personnel use a variety of tools to study the behavior of an electronic package and its constituents under different mechanical and/or thermal loading conditions: like dynamic warpage of package using optics-based tools, adhesion strength characterization of various interfaces in a package using Double Cantilever Beam test, fracture toughness measurement of bulk materials using three-point bend test, and CTE measurement using 3D Digital Image Correlation method. A typical job would involve design of experiment, setup definition including fabrication, sample preparation, data collection & analysis, report presentation, and documentation. Seeking motivated candidates for developing experimental techniques to characterize material behavior under thermo-mechanical loading conditions and study in-situ damage initiation/propagation. Encourage candidates with a strong background in Experimental Mechanics.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth