In this position you will be a key member of the SCE-PCB materials engineering team. You will be the PCB technical expert, but must also have some business acumen. You will regularly interact with PCB Commodity Managers, other Materials Engineers, Corporate and Business Unit Quality Engineers, Business Unit Design and Manufacturing Engineers, and PCB factory engineering and sales specialists in solving supply chain issues. You will support the efforts of multiple business units and have direct interaction with the PCB factory engineers and visit various PCB factories regularly. Specific responsibilities will include: * Support various BU programs on PCB supply line requirements including design for cost, marketing intelligence, supplier technology and capability, product development and qualifications, supplier sourcing/selections, troubleshooting, quality management, product performance, and other aspects of PCB design, fabrication, and supply chain management. * Ability to assess PCB designs and provide recommendations for optimal performance at lowest cost. Driving for lowest cost is priority, quality is an expectation. * Will own supplier technology and product qualifications. * May support and eventually lead supplier quality and process audits. Ability to assess new and existing suppliers for supporting multiple Intel products and business units. * Drive supplier process quality and capability improvements as necessary to support Intel programs. * Own and support supplier quality excursions. * Ability to handle multiple projects to meet often demanding schedules. * Must be able to work in an ambiguous environment. * Work with suppliers to define requirements and hold suppliers accountable for their manufacturing process flow to meet quality, reliability, cost, yield and manufacturability requirements. Drive continuous process and quality improvements.
You should possess a minimum of a Bachelor of Science degree in Chemistry, Chemical Engineering, Materials Science, Manufacturing Engineering, or Mechanical Engineering, degrees in other science or engineering disciplines will be considered. Additional qualifications include: * A minimum of 2 years' experience in PCB or Prepreg Substrate manufacturing operations is highly desired. Strong preference given for PCB experience as a process engineer, field applications engineer, quality engineer, or related position. * In-depth knowledge of PCB technology at all levels of manufacturing, from design and fabrication through outgoing quality control and packaging is desired. *Ability to drive failure analysis to determine root cause and systematically implement corrective actions to prevent reoccurrence. * A thorough understanding of statistical process control and how it relates to PCB fabrication. * Good project management skills with ability to influence teams in a cross-functional atmosphere. * Good communication skills with ability to clearly communicate at all levels of management both internal & external. * Knowledgeable of local and global PCB supply base is a plus. * Understanding of RoHS, REACH, and other environmental compliance laws and initiatives is helpful. * Knowledge of raw materials, surface finishes, automotive TS16949 requirements, IPC PCB specifications IPC-A-600, IPC-6012, impedance modeling, Valor DRC analysis, substrate/substrate-like PCBs, and/or understanding of PCBA processes and interactions are desired. * Basic understanding of manufacturing processes, raw materials, and design for manufacture experience is very valuable. * Written and spoken fluency in English and Mandarin Chinese is required.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth
Hong Kong, Kowloon;PRC, Shenzhen;Taiwan, Taipei;US, Oregon, Hillsboro