In this position, you will be performing Failure Analysis and root cause analysis on Intel SoC, CPU, Chipsets and Netcomm platform products.
This includes PC system and/or tester testing and analysis to isolate the failing instruction and internal signal, applying circuit analysis and various device localization equipment and techniques to localize the failing circuitry and performing physical failure analysis to locate the defect.
Your responsibilities will include but not be limited to :
1. Responsible for improving product yield, quality and reliability through the recommendation of corrective actions to counterparts in Fab and Assembly and Test for root cause fix.
2. Participating in new product and/or technology transfer and startup, enabling automation and improvement on the failure analysis process, tools and methodology, developing new FA techniques and proliferating learning across sites
Inside this Business Group
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.