The Customer Platform Technology Development group is the motherboard and system research and development arm within Intel. Our internal factory assembles prototypes of next generations smartphones, tablets, ultrabooks, wearable devices, servers, supercomputers and other electronic devices. Our group is also responsible for developing and validating the SMT manufacturing process for new Intel components and sockets. We are looking for a self-starter with strong communications skills and the ability to apply classroom learnings to solve complex assembly problems associated with next generation devices.
Our intern will be exposed to surface mount technology, printed circuit board assembly, design for manufacturing, project management, electrical test, statistical methods, design of experiments and product development.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Be pursuing a graduate degree in mechanical, electrical, manufacturing, or material science engineering.Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth