We are currently developing the next generation of our HDMT tester, including significant HW and SW architectural changes above and beyond current generation ATE, that will enable a universal "tester cell" infrastructure and provide the best user experience for Intel Product Development community. The team includes all aspects of HW and SW development of the tester software stack. This intern will be working with 30+ software engineers to develop the runtime software and interactive tools for the HDMT tester. Our HDMT software development engineers have the opportunity to contribute to the entire tester operating software stack & ecosystem such as PCIe/USB Windows drivers, C++ data structure/compiler, API, GUI, etc. We are looking for a Intern student that has some experience knowledge in Object Oriented Programming wit C++ preferred
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Be pursuing a Master Degree in Computer Science. Students who get a Bachelor degree in Electrical Engineering and then a Master in Computer Science, could be also consider or any combination in your degrees of Computer Science, Computer Engineering and Electrical Engineer will also work for this opportunity.
Some experience / knowledge in C++, C, C coding skills either at school or previous internships.
Some experience / knowledge with script languages such as Perl and Python.
Electrical Engineer background a plus.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth