Internship with Intel's Mechanical Core Competency laboratory located in Hillsboro, Oregon. You will be responsible for developing metrologies and mechanical testing of materials and components to support new packaging technologies. You will proactively use available resources to research and to conduct experiments. Regular documentation and presentation of results and progress are expected. Routine work includes formulating sound experiment or test strategies, troubleshooting metrologies and methodologies, designing and integrating appropriate hardware/software, and documenting/presenting results.
Additional responsibilities include applying and utilizing existing metrologies to new problems and developing new custom metrologies or testing apparatus for situations where commercial tools do not exist.
You are expected to observe all safety procedures and ISO requirements.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth