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Job ID: JR0041801
Job Category: Engineering
Primary Location: Phoenix, AZ US
Other Locations:
Job Type: Experienced Hire

IOTG Senior CAD Engineer PCB Layout

Job Description
Job Description:In this position, you will be part of Intel's Internet of Things Group IOTG, working in Systems Engineering Group SEG. SEG is the central engineering pillar for IOTG, providing engineering services to enable development of platforms that span Retail, Transportation, Industrial and Energy, and Markets and Channels. Responsibilities include working on a variety of designs, ranging from dense form factor reference designs to large validation platforms. The work you will do: You will work on multiple facets of PCB layout while collaborating with HW, Signal Integrity and Package Design Engineers. Responsibilities will include but not be limited to the following: - Ownership of the layout from feasibility studies to board tape-out - Constraint entry of signal integrity guidelines - Placement and routing studies - Board routing studies to optimize new package ball-maps - Interface with Manufacturing Engineers and PCB vendors to support board builds - Creation of physical library symbols PCB land patterns


Qualifications

You must possess the below minimum qualifications to be initially considered for this position. Qualifications listed as preferred will be considered a plus factor for applicants. Minimum Qualifications: - 4 or more years of experience with PCB layout utilizing Cadence Allegro - 1 or more years of experience with creating PCB layout symbols using Cadence tools. - Proficient with the Cadence Allegro and Cadence Constraint Manager v16.6 or later - Familiarity with all phases of hardware development including: schematic entry, signal integrity practices and theories, constraint entry, library creation, DFM - Ability to own and manage highly complex PCB designs both individually as well as part of a team while working across multiple sites - Ability to manage external CAD contract workers to meet project demandsAdditional Preferred Qualifications: - Experience with a broad range of PCB form factors - Experience with HDI / Type4 PCB design - Candidate must have a strong interest and motivation to develop innovative - solutions in a challenging and dynamic environment - Excellent analytical and problem solving skills - Excellent verbal and written communication skills - Ability to travel when required - A self-starter, highly motivated, team player

Inside this Business Group

Employees of the Internet of Things Solutions Group (IOTG) have an exciting opportunity before them: To grow Intel's leadership position in the rapidly evolving IoT market by delivering the best silicon, software and services that meet a wide range of customer requirements - from Intel® Xeon® to Intel® Quark®. The group, a fresh, dynamic collaboration between Intel's Intelligent Solutions Group and Wind River Systems, utilizes assets from across all of Intel in such areas as industrial automation, retail, automobiles and aerospace. The IOTG team is dedicated to helping Intel drive the next major growth inflection through productivity and new business models that are emerging as a result of IoT.


Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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