SPTD Dielectrics and Surface Prep Area is looking for Engineering Interns to join the team in support of next generation substrate package technology development. Interns will support one or many Process Engineers in the Area supporting processes such as lamination, curing, etching, sputtering and other thin film processes.
In addition, Interns will be required to plan and conduct experiments in a lab setting as well as on the manufacturing floor.
Interns will also need to support in chemical/mechanical/physical characterization per project necessities. This is a handson position requiring physical presence on the manufacturing floor or lab. Given the research and development nature, a
high tolerance for ambiguity is needed.
The ideal candidate should exhibit the following behavioral traits:
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth