Graduate Engineers will drive rapid continuous improvements in safety, quality, yield, reliability, cost, process stability/capability, output and productivity while maintaining rigorous Copy Exactly CE and best tool matching within the Intel 300mm factory network. Need a strong technical background and capabilities to sustain, ramp, and transfer technologies using state of the art equipment and materials in one or several of the following areas: Thin Films ALD, CVD, PVD, Plating, Thermal Diffusion, RTA, EPI, Planar, Yield, Implant, Lithography, Etch Wet, Dry, or Metrology. Specific responsibilities include: Equipment troubleshooting and sustaining ownership of daytoday operations Continuously improve process and equipment operational indicators quality, cycletime, capacity cost Deliver bestinclass results for tool availability, defects and parametric performance Meet tool and process matching requirements throughout startup and ramp of new technology transfer Developing solutions to problems utilizing formal education, statistical knowledge, problemsolving tools and judgment Handson participation with frequent factory floor presence Commitment to work shift or regular work week as needed.
Student for logic design and validationInside this Business Group
The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.