This is an Intern level position for Semiconductor Design Development in the Assembly/Test Technology Development ATTD department at Intel including responsibilities from technology drawings and media development to enable manufacturing.
Job Scope includes interfacing with ATTD design substrates/assembly/test teams to:Complete media designs and product drawings during product definition, Identify roadblocks to product milestones related to media and drawings and drive closure,
Research design methods used in media, drawings and collaterals to streamline manufacturability. Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Be pursuing or be a current student in B.S. or M.S. program on track to obtain a degree in Mechanical Engineering, Electrical Engineering, Material Science or Computer Science.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth