Microelectronic Quality Reliability Engineers provide project management, product, process design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components, sub systems and/or completed units. You will join a team of experts doing innovative and exciting work in developing state of art methodologies. You will be solving complex problems starting from comprehending field conditions and usage of computational systems laptops, wearable, data centers, drones, cars, etc., to doing a deep dive into the physics of failure and ultimately developing methodologies to enable design and field performance of industry leading technologies. This is an entry level position and will be compensated accordingly.
Your responsibilities will include but not be limited to:
Development of predictive computational modeling methods and tools for reliability risk assessment and design of semiconductor packages and systems.
Determination of reliability requirements of components and systems to achieve company and customer reliability objectives.
Development of new reliability models and tools to assure the early identification of potential problems with new products, packaging, processes.
Providing consultation to design engineers on selection, application and test of electronic components and systems.
Providing consultation to customers/client as needed.
The ideal candidate should exhibit the following behavioral traits:
Attention to details and quality of the work
Persistence, perseverance and commitment to task
Ability to clearly communicate achieved results
Ability to influence and advocate for new ideas
Ability to work well in a team setting with people from a wide range of backgrounds
Ability to understand the high level picture and apply systems thinking to generate solutions
You must possess the below minimum qualifications to be initially considered for this position. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences.
Must have a PhD degree in Mechanical Engineering, Applied Mechanics, Aeronautics, Structural Engineering , Materials Science or related field.
Minimum 1 year of experience in solid mechanics and/or computational mechanics.
Minimum 1 year of experience with numerical modeling methods and automation tools, especially the finite element method.
Minimum 6 months fracture mechanics, plasticity theory, mechanics of materials, structural mechanics including statics, dynamics and thermo-mechanics.
Experience with machine learning neural networks, optimization methods
Experience with stochastic finite elements
Knowledge of statistics
Experience with various material and structural experimental characterization techniques
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth