Inside this Business Group
Preferably Masters Degree in Engineering/Science in Materials/Chemical/Mechanical/ Chemistry/Physics with min 8 years working experience or Bachelors Degree with 10 years working experience. Strong knowledge& experience in Electronic Packaging specifically in High Density Interconnect HDI Substrates manufacturing process and quality control is highly desired. Experience in Assembly Test Process will also be an added advantage. Candidates are expected to posses strong problem solving skills, strong statistics and Statistical Process Control SPC knowledge and hands-on experience in driving process and yield improvements in a High Volume Manufacturing environment. Candidates are expected to posses strong communication skills in English both written and verbal along with strong influencing and stakeholder management skills.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth