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Job ID: JR0045474
Job Category: Intern/Student
Primary Location: Hillsboro, OR US
Other Locations:
Job Type: Intern

Undergraduate Intern Technical

Job Description

As a member of the Systems Components Development SCD / Pathfinding Sciences Team, you will be in a position to make important contributions to the design of server specific CPU mechanical components. Candidate will be responsible for assisting in the development of CPU thermal/mechanical solutions for various server and workstation market segments, and working with a team of cross site architects, mechanical, thermal and electrical engineers

Responsibilities may be quite diverse of a nonexempt technical nature. U.S. experience and education requirements will vary significantly depending on the unique needs of the job. Job assignments are usually for the summer or for short periods during breaks from school. Successful Candidate would be working in a research and development environment conducting experiments and organization of experimental details. Daily meetings with focused execution of daily, weekly tasks working with thermal, mechanical and electrical controls systems

Selected candidate should be able to demonstrated Organization skills and willingness to navigate a research environment.


Must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Experience listed below would be obtained through a combination of your school work/classes/research and/or relevant previous job and/or internship experiences. 

Minimum requirements:

Candidate must be working towards an Engineering Science B.S. Degree.

6 + months experience in the following areas:

  • Basic Microsoft Office programs Excel/Word/PowerPoint

  • Electronics, data bases, basic electric circuits

Additional Qualifications:

  • Knowledge of statistical mathematics.

  • Knowledge of computer layouts and basic architecture

  • Knowledge of basic heat transfer processes conduction/convection.

  • Familiarity with common manufacturing & design processes such as: sheet metal, plastic injection molding, machining, die casting, cold forming, etc. is a plus.

  • Familiarity with Windchill PDM is a plus.

  • Familiarity with general lab testing procedures such as basic instrumentation, data acquisition, fixture design, etc.

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

Posting Statement. Intel prohibits discrimination based on race, color, religion, gender, national origin, age, disability, veteran status, marital status, pregnancy, gender expression or identity, sexual orientation or any other legally protected status.
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