Inside this Business Group
1.The candidate should be a graduate recently with Bachelor or Master degrees in Packaging Engineering or Mechanical Engineering related. 2.He or she should also be experienced in CAD/CAE software. 3.Familiar with ISTA guidelines and packaging related testing standards.4.Familiar with packaging materials commonly used in electronics product and transportation. 5.The knowledge about supply chain or logistics can be a plus.Note : this is a Strategic Hiring for GLO Logistics based in Shanghai, PRC which will be under Rotation for one year under the College Graduate CG Program in CPLG.
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth