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Job ID: JR0043472
Job Category: Engineering
Primary Location: Shanghai, Shanghai CN
Other Locations:
Job Type: College Grad

Packaging Engineer

Job Description

The "Transport Materials and Media Engineering Group" TMME is a worldwide organization that delivers shipping media and packaging solutions for all Intel products and direct materials used in our manufacturing facilities and warehouse operations. In this position you will be responsible for the design, development, and qualification for the shipping media and packaging used to transport materials internally site to site and for finished products shipped to our customers. This includes wafers, bare die, finished microprocessors, solid state drives, board assemblies, and other varied products. The successful candidate will also be designing and conducting test experiments to gather performance data on Intel shipping media and packaging to help understand design requirements and materials necessary to protect Intel products now and in the future. This will require working in a lab environment using packaging test equipment and metrologies such as package drop, shock, vibration, accelerometer data acquisition, and data analysis using Excel and JMP statistical software.


1.The candidate should be a graduate recently with Bachelor or Master degrees in Packaging Engineering or Mechanical Engineering related. 2.He or she should also be experienced in CAD/CAE software. 3.Familiar with ISTA guidelines and packaging related testing standards.4.Familiar with packaging materials commonly used in electronics product and transportation. 5.The knowledge about supply chain or logistics can be a plus.Note : this is a Strategic Hiring for GLO Logistics based in Shanghai, PRC which will be under Rotation for one year under the College Graduate CG Program in CPLG.

Inside this Business Group

As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth

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