Job Description Responsible for the architectural definition of the boards and interfaces in complex multi-board highly dense HPC systems. Provides technical leadership in a heavily matrixed team consisting of hardware, mechanical, thermal, bios and FW during planning, concept generation and through development. Will work closely with SoC and platform architecture teams ensuring high density HPC product requirements are met. Responsibilities include but are not limited to the following: Writing detailed specificationsPerforming architecture and design analysisServing through the design, integration and validation phases as the hardware expert for product featuresLeading complex feature integrationsTroubleshooting problems until delivery of the product is complete at the highest quality.
Inside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.