The NVM Solutions Group NSG is seeking a Component Packaging Development Program Manager for the development of Non-Volatile Memory discrete package components. In this role you will coordinate, interact, and communicate with Intel Asia assembly team, Intel fabs, and the Intel Product Development Team PDT to drive assembly process development project objectives. The candidate will manage supplier to develop and deliver Proof of Concept POC, engineering sample ES, qualification sample QS and production ramp assembled products. The candidate will lead the members from different teams to provide assembly process solutions and define qual strategies. He/she will work with stakeholders including the NSG Product Development Team PDT lead, planning, fab, QRE, and product engineer to resolve technical issues, maintain project schedules, and on-time qualification. The candidate will work closely with Intel HVM Operations and suppliers to achieve new product and package transfer to high volume manufacturing. This role also provides opportunity for support of path finding programs, Si packaging early evaluation programs, and solder joint reliability risk assessment.
Non-Volatile Solutions Memory Group: The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices. The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.