The candidate will be responsible for physical failure analysis of packaged/un-packaged semiconductor product or test chip material employing results to establish root cause. You will assist engineering in assessment of process health and defect identification.
Owns Transmission Electron Microscopy (TEM) prep and/or hands-on physical analysis, including sample preparation for probing or TEM imaging. Assignments are semi-routine in nature but require a wide array of laboratory techniques and skills. Judgment required to resolve nonstandard problems. Normally receives general instructions on work from engineers.
-Organizing work to ensure accomplishment of associated tasks including analysis, documentation and follow through.
-Work from technical documents, design layout, written Best Knowledge Methodologies (BKM) and/or verbal directions to complete tasks in assigned areas.
-Maintain necessary records and reports. Perform other related duties as required or as directed.
The successful candidate will be expected to master TEM prep and/or de-layering/de-processing techniques including but not limited to polishing, dimpling, CNC milling, wet and dry etch, Focus Ion Beam FIB assisted depositions and milling, SEM inspection, TEM prep and other PFA techniques to facilitate FA on the latest semiconductor processes. Candidates with the right background and basic electron microscopy skills will be trained as required in all necessary competencies.
The ideal candidate should exhibit the following behavioral traits:
Attention to detail, focus to execute and willingness to learn new techniques is essential.
Inside this Business Group
As the world's largest chip manufacturer, Intel strives to make every facet of semiconductor manufacturing state-of-the-art -- from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore’s Law to bring smart, connected devices to every person on Earth