Conducts or participates in multidisciplinary research in the design, development, testing and utilization of information processing hardware and/or electrical components, mechanisms, materials, and/or circuitry, processes, packaging, and cabinetry for central processing units CPUs and/or peripheral equipment. Prepares specifications, evaluates vendors, and analyzes test reports. Ensures products conform to standards and specifications. Develops plans and cost estimates and assesses projects to analyze risk. Develops procedures, analysis and design for computer components, products, and systems. Initiates, guides, and coordinates overall design and development of new ideas and products. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgement.
Intel® Silicon Photonics Product Division (SPPD) is at the forefront of silicon photonics integration. Since announcing the world’s first hybrid silicon laser nearly a decade ago, our team continues to lead the industry with cutting-edge technology and efficient, scalable high-volume manufacturing. Our dedication to advanced development ensures that Intel Silicon Photonics continues to drive future data center bandwidth growth with smaller form factors and higher speeds, from 100G today to 400G and beyond tomorrow. We are looking for great talent to accelerate this journey, so if you are interested in joining our leading organization, then we want to hear from you!
Masters of Science in Electrical Engineering or closely related field, plus 6+ years of experience in fiber optics, optical networking, optical and RF modulation, and data networking architectures.
Experience with physical layer optical transmission systems, ROSA/TOSA/BOSA, Mach-Zehnder modulators, burst receivers, optical polarization, link impairments and link power/OSNR budget estimation, is required.
First level IC package design experience to include package design and analysis, broad package technology experience, circuit designer engagement experience
Experience with different modulation PAM4/NRZ formats, optical direct detection, coherent detection, and the fundamental digital signal processing DSP algorithms such as polarization de-multiplexing and clock/carrier recovery, is required.
Deep understanding of RF IC Transceiver architectures, design & tradeoffsExperience with design of high speed mixed signal circuits e.g., SerDes - analog/DSP based architectures, RX/TX equalization
Experience with design of Analog RF front end circuits such as Drivers, Trans-Impedance Amplifiers TIA, limiting amplifiers, etc.
Good understanding of low noise PLL, Clocking and data recovery architectures.
Deep understanding of Signal Integrity, Power Integrity and Channel modeling using industry standard tools such as HFSS, ADS etc
System knowledge of current generation and next generation optical transceiver architectures and standards.
Strong written and verbal communication skills, with the specific ability to speak to various technical and management levels.
Proactive, collaborative and creative approach to innovation, technical development and consensus facilitation to influence optimal project results.
Excellent time and task management, and inter-personal skills.
Willingness to travel when requiredInside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.