Your responsibilities will include but not limit to:
-Performs comprehensive simulations and validations to generate Intel design guidelines to guide system level power integrity design including, but not limit to, silicon, package, socket, boards and voltage regulators.
-Performs AC and transient simulation to provide impedance profile of the whole power delivery path, from the VR to the motherboard, the package and the die. Provides guidance to the design team on capacitor numbers & values and power plane shape & width. Correlating simulations with system measurements.
-Provides DC and resistance simulation to provide Rpath from the VR to the package pins, voltage drop, current density and power loss analysis.-Performs transfer impedance simulations to provide plane The ideal candidate should exhibit behavioral traits that indicate:
-Discipline and results orientation
-Strong written and verbal communication skills in English
-Ability to communicate effectively across multiple disciplines, such as silicon design, package design, board design, PCB layout, and mechanical design
-Ability to work effectively in a dynamic team environment
MS or PhD in Electrical Engineering or Electrical and Computer Engineering , CGInside this Business Group
The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.