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Job ID: JR0040018
Job Category: Engineering
Primary Location: Penang, PNG MY
Other Locations:
Job Type: College Grad

Package Electrical Engineer

Job Description

Package Electrical Engineer is responsible to deliver the electrical analysis work for the Intel Custom Foundry's ICF customers and Intel Products. He/she will need to ensure that the package design are meeting the electrical requirement such as signal integrity and power integrity. He/she will need to work with the stakeholders to gather the requirements, perform the relevant electrical analysis in a timely manner to support the business needs.The responsibilities include but not be limited to:- Managing the overall electrical design analysis delivery including the schedule, working with different stakeholders to ensure the work is on track and meets the electrical performance requirement.- Performing electrical analysis that includes signal integrity analysis and power delivery analysis to ensure the product will meet the requirements.- Providing recommendations/solutions in the Silicon/Package/Board parameters to meet the requirements while beating product cost target if applicable.- Be responsible to support any given task on Product or Foundry electrical design work. Self initiative to follow up on the latest electrical challenges faced by Intel's product or customer's foundry product. - Continuously improve in the electrical analysis/package design work either by coming up with innovations or driving efficiency that helps improve cost, schedule and/or quality for the design that ultimately add value to our company.


Qualifications

You must possess a Bachelor, Master or PhD degree in Electrical/Electronics Engineering. Additional qualification includes but not limited to: - Strong technical knowledge of electrical field theories and electronic fundamentals. Those with sound knowledge in electromagnetic and microwave theory are encouraged to apply. - Experienced in using Electrical Design Analysis software tools such as Ansoft HFSS, Ansoft Q3D, ADS, HSpice, Sigrity or any equivalent software will be added advantage. - Experienced in using Package/Board CAD layout software tool such as Cadence, Mentor Expedition or any equivalent software will be added advantage. - Those with strong project management skills and the passion to continuously learn. - The applicant should also have excellent communication written and presentation and problem solving skills.- Excellent team work is an expectation.

Inside this Business Group

The Platform Engineering Group (PEG) is responsible for the design, development, and production of system-on-a-chip (SoC) products that go into Intel’s next generation client and mobile platforms. PEG strives to lead the industry moving forward through product innovation and world class engineering.

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