Microelectronic Packaging Engineers provide project management, package design/development and sustaining support for integrated circuit or semiconductor assemblies, various other electronic components and/or completed units. Responsible for the thermal/mechanical/electrical design, analysis, and development of electronic packages. Defines overall package performance and specification and realizes technology certification through layout design and test vehicle design. Conducts tests and research on basic materials and properties. Establishes material specifications for contract assemblers and raw material vendors and interfaces with Quality Assurance and Purchasing regarding material quality and vendor performance. Provides consultation concerning packaging problems and improvements in the packaging process. Responds to customer/client requests or events as they occur. Develops solutions to problems utilizing formal education and judgment.
Expertise and knowledge
Please be informed that Intel is proactively trying to find candidates for this position which is frequently available at Intel Deutschland. Please note that the position may not be available at this time. If you would be interested in this position should it become available, we would encourage you to apply, and our hiring team will be glad to contact you when/if relevant.
Inside this Business Group
Communication & Devices Group: The wireless revolution at Intel! We are one team - passionate engineers and technologists from diverse industry backgrounds working together to realize a world of connected computing. We are bringing the best ideas from the brightest minds to deliver future mobile experiences into the market. We are on the journey towards making Intel a wireless leader with exciting products for the Internet of Things, 5G and an opportunity to change the world with your work.